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Flip-Chip Technologies and Global Markets

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SOURCE Reportlinker

NEW YORK, Jan. 23, 2014 /PRNewswire/ -- Reportlinker.com announces that a new market research report is available in its catalogue:

Flip-Chip Technologies and Global Markets

http://www.reportlinker.com/p01941933/Flip-Chip-Technologies-and-Global-Markets.html#utm_source=prnewswire&utm_medium=pr&utm_campaign=Electronic_Component_and_Semiconductor

INTRODUCTION

Flip chip technology has enabled electronics technology to reach new levels of performance, while fueling the growth of global markets for semiconductors, electronic devices and a host of industrial and consumer products.This market research report examines, quantifies and forecasts the growth of flip chip technologies and provides guidance to interested parties.

STUDY GOALS AND OBJECTIVES

• Analysis of flip chip technology market trends and dynamics, including the factors currently driving and restraining the growth of the market as well as their impact over the long term.• Opportunities and innovation-driven flip chip market highlights and the major regions and countries involved in such developments.• Analysis of the various applications of the flip chip market and market dynamics of each application.• Identifying segments with high growth prospects with a discussion of future applications within each segment.• Key trends related to the product, technology, prices and applications that shape and influence the flip chip market.• Region-specific developments and distinctive characteristics.• The major stakeholders in the market and the competitive landscape.• Analysis of the key growth strategies of key players in the flip chip market.• Patent analysis where relevant.

REASONS FOR DOING THE STUDY

In recent years, the growth of flip chip interconnect technology over other interconnect technologies has been remarkable. This is due to the increasing complexity of the architecture of chip design and fabrication. Increased demand for small-size chips ranging from around 12 mm to 35 mm chipsets has increased the market. This study defines the scope of flip chips with a segmental analysis such as by application and end user, helping the reader gain knowledge about technological as well as analytical aspects of the industry.

SCOPE OF REPORT

The market for flip chip technology is segmented into following categories:• Wafer bumping process:o Copper (Cu) pillar.o Lead (Pb)-free solder.o Tin-lead (Sn-Pb) eutectic solder.o Gold stud + plated solder.• Application area:o 2D logic system-on-a-chip (SoC)o Memoryo Imaging, high-brightness light-emitting diode (HB-LED) small logico RF, power, analog and mixed signal ICs.o µ-bumping for 2.5D/3D system-in-package/system-on-a-chip (SiP/SoC).• End use:o Smartphones.o Laptops.o Desktop CPUs.o GPUs and chipsets.o Other computing devices.o Automotive.o Robotics.o Medical devices.o Smart technologies.o High-performance/industrial applications.• Geographical regions:o North America (the U.S., Canada and Mexico)o Europe (Italy, France, Germany, U.K. and other countries).o Asia-Pacific (China, Japan, Taiwan, South Korea, India and other countries).o ROW (Middle East and Africa).

This report also provides a competitive analysis of the industry, a patent analysis and a chapter including company profiles.

INTENDED AUDIENCE

• Manufacturers.

• End-user companies.

• Foundries.

• Researchers.

• Raw material providers.

• Players involve in testing phase.

• Investors (private equity, venture capital, etc.).

INFORMATION SOURCES

BCC Research conducted primary and secondary research to develop this report including:

• Primary sources:

o Selected experts from related industries.

o Preferred suppliers.

• Secondary sources:

o E-magazines.

o Directories.

o Databases such as OneSource, Factiva, Bloomberg, SEC filings Reuters.

o Stock exchanges such as TMX, NASDAQ, ASX and LSE.

ANALYST CREDENTIALS

Gaurav Bhushan holds an MBA in Finance from ICFAI Business School, Hyderabad (India) and a Bachelor's degree in Electrical Engineering from Rajasthan University (India). He focuses on client information requests within the electronics and semiconductor market, helping them to understand the market. He has close to four years of experience in the field of market research in electronics, financials and database design. His areas of interest include semiconductors, automation, industrial controls, recent technologies, robotics and nanotechnology. He has published works on quantum dots, big data, ultracapacitors, home automation, HMDs, factory automation, and the RF components market.REPORT HIGHLIGHTS

The global market for Flip Chip Technology by wafer bumping process reached $18.9 billion in 2012. This market is expected to grow to $20.1 billion in 2013 and $36.5 billion in 2018, a compound annual growth rate (CAGR) of 12.7% over the five-year period from 2013 to 2018.

This report provides:

• An overview of the global market for flip-chip technologies, a process to interconnect IC's and other microelectronics devices (MEMS) to the external circuitry by means of a solder bumping process deposit on pads.

• Analyses of global market trends, with data from 2012, estimates for 2013, and projections of compound annual growth rates (CAGRs) for the period, 2013 to 2018.

• Discussion of the evolution, architecture, and value chain of flip-chip technologies.

• Examination of market dynamics, including drivers, restraints, and opportunities.

• Analysis of the flip-chip assembly market by geography, including North America, Europe, Asia-Pacific, and others.

• Coverage of the competitive landscape, including mergers and acquisitions, collaborations and agreements, and new product development.

• Comprehensive company profiles of major players.

TABLE OF CONTENTS

CHAPTER 1 INTRODUCTION 2

STUDY GOALS AND OBJECTIVES 2REASONS FOR DOING THE STUDY 2SCOPE OF REPORT 2INTENDED AUDIENCE 3INFORMATION SOURCES 3ANALYST CREDENTIALS 4RELATED BCC RESEARCH REPORTS 4BCC RESEARCH ONLINE SERVICES 4DISCLAIMER 4

CHAPTER 2 SUMMARY 6

SUMMARY TABLE GLOBAL MARKET FOR FLIP CHIP TECHNOLOGY BY WAFERBUMPING PROCESS, THROUGH 2018 ($ MILLIONS) 7SUMMARY FIGURE GLOBAL MARKET FOR FLIP CHIP TECHNOLOGY BY WAFERBUMPING PROCESS, THROUGH 2018 ($ MILLIONS) 7

CHAPTER 3 OVERVIEW 9

MARKET DEFINITION 9EVOLUTION OF FLIP CHIP WAFER BUMPING TECHNOLOGIES 9FIGURE 1 DEVELOPMENT OF WAFER BUMPING TECHNOLOGIES, 1960-2004 9SOLDER EVAPORATION 9FIGURE 2 SOLDER EVAPORATION PROCESS 10ELECTROPLATING OF SOLDER ALLOYS 10FIGURE 3 SOLDER ALLOY ELECTROPLATING PROCESS 10SOLDER PASTE SCREENING 11FIGURE 4 SOLDER PASTE SCREENING PROCESS 11SOLDER BALL REPLACEMENT 12C4NP PROCESS 12VALUE CHAIN ANALYSIS 13FIGURE 5 VALUE CHAIN OF FLIP CHIP TECHNOLOGY INDUSTRY 13SUPPLY CHAIN ANALYSIS 14FIGURE 6 FLIP CHIP INDUSTRY SUPPLY CHAIN 14

CHAPTER 4 FLIP CHIP TECHNOLOGY MARKET BY WAFER BUMPING PROCESS 17

INTRODUCTION 17FIGURE 7 GLOBAL FLIP CHIP TECHNOLOGY MARKET SHARES BY WAFER BUMPINGPROCESS, 2012 AND 2018 (%) 17TABLE 1 GLOBAL FLIP CHIP UNIT SALES BY WAFER BUMPING PROCESS, THROUGH2018 (UNITS) 18FIGURE 8 GLOBAL FLIP CHIP TECHNOLOGY MARKET SHARES OF UNIT SHIPMENTSBY WAFER BUMPING PROCESS, 2012 AND 2018 (%) 18TABLE 2 GLOBAL MARKET FOR FLIP CHIP TECHNOLOGY MARKET BASED ON THEAVERAGE PRICE PER UNIT OF THE WAFER BUMPING PROCESS, THROUGH 2018 ($MILLIONS)19MARKET DYNAMICS 19Drivers 19Introduction of New Metals and Processes in Flip Chips 19Consumer End-User Demand 20Restraints 20Government Rules and Regulations 20European Union 20High Investment Cost 21Current Solder Bumps Still Have Structural Problems 21CU PILLAR 21TABLE 3 GLOBAL MARKET FOR CU PILLAR FLIP CHIPS BY END USE, THROUGH 2018($ MILLIONS) 22FIGURE 9 Y-O-Y GROWTH IN DOLLAR AND UNIT SALES OF CU PILLAR FLIP CHIPS,THROUGH 2018 (%) 22CU BUMPING FEATURES 23SIGNIFICANT PATENTS ON CU PILLAR FLIP CHIP TECHNOLOGIES 24SN-PB EUTECTIC SOLDER 25TABLE 4 MECHANICAL PROPERTIES OF SN-PB 26TABLE 5 PHYSICAL PROPERTIES OF SN-PB 26TABLE 6 GLOBAL MARKET FOR SN-PB FLIP CHIPS BY END USE, THROUGH 2018 ($MILLIONS) 27FIGURE 10 Y-O-Y GROWTH IN DOLLAR AND UNIT SALES OF SN-PB FLIP CHIPS,THROUGH 2018 (%) 27ADVANTAGES OF SN-PB EUTECTIC SOLDER 28DISADVANTAGES OF SN-PB EUTECTIC SOLDER 28SIGNIFICANT PATENTS ON SN-PB SOLDER TECHNOLOGIES 28LEAD-FREE SOLDER 29TABLE 7 CHARACTERISTICS OF VARIOUS ELEMENTS 30TABLE 8 CHARACTERISTIC OF VARIOUS MIXED COMPOSITIONS 30PROPERTIES OF SOME COMMONLY USED ALLOY SYSTEMS 3158Bi-42Sn 3152In-48Sn 32MARKET SNAPSHOT 32TABLE 9 GLOBAL MARKET FOR PB-FREE FLIP CHIPS BY END USE, THROUGH 2018($ MILLIONS) 32FIGURE 11 Y-O-Y GROWTH IN DOLLAR AND VOLUME SALES OF LEAD-FREE FLIPCHIPS, 2013-2018 (%) 33SIGNIFICANT PATENTS ON LEAD-FREE FLIP CHIP TECHNOLOGIES 33GOLD STUD BUMPING 35MARKET SNAPSHOT 36TABLE 10 GLOBAL MARKET FOR GOLD STUD BUMPED FLIP CHIPS BY END USE,THROUGH 2018 ($ MILLIONS) 36FIGURE 12 Y-O-Y GROWTH IN DOLLAR AND VOLUME SALES OF GOLD STUDBUMPED FLIP CHIPS, THROUGH 2018 (%) 36SIGNIFICANT PATENTS ON GOLD STUD BUMPING TECHNOLOGIES 37

CHAPTER 5 FLIP CHIP TECHNOLOGY MARKET BY APPLICATION 40

INTRODUCTION 40FIGURE 13 MARKET SEGMENTATION BY APPLICATION 40TABLE 11 GLOBAL MARKET FOR FLIP CHIP TECHNOLOGIES BY APPLICATION,THROUGH 2018 ($ MILLIONS) 41FIGURE 14 GLOBAL MARKET FOR FLIP CHIP TECHNOLOGIES BY APPLICATION,2012- 2018 ($ MILLIONS) 41MARKET DYNAMICS 42Drivers 42Development of 3D ICs 42Double Data Rate Fourth-Generation (DDR4) Memory 42Restraints 422D LOGIC SOC 42FIGURE 15 STRUCTURE OF MULTI-CHIP MODULE 43FIGURE 16 STRUCTURE OF SYSTEM ON CHIP 43TABLE 12 GLOBAL MARKET FOR FLIP CHIPS USED IN 2D LOGIC SOC APPLICATIONSBY REGION, THROUGH 2018 ($ MILLIONS) 45MEMORY 45TABLE 13 COMPARATIVE ANALYSES OF VARIOUS TYPES OF MEMORY 45TABLE 14 GLOBAL MARKET FOR FLIP CHIPS USED IN MEMORY APPLICATIONS BYREGION, THROUGH 2018 ($ MILLIONS) 47FIGURE 17 Y-O-Y GROWTH OF THE MARKET FOR FLIP CHIPS USED IN MEMORYAPPLICATIONS, THROUGH 2018 ($ MILLIONS, %) 47IMAGING 48TABLE 15 GLOBAL MARKET FOR FLIP CHIPS USED IN IMAGING TECHNOLOGIES BYREGION, THROUGH 2018 ($ MILLIONS) 49FIGURE 18 Y-O-Y GROWTH OF THE MARKET FOR FLIP CHIPS USED IN IMAGINGTECHNOLOGIES, 2012–2018 ($ MILLIONS, %) 50HIGH-BRIGHTNESS LIGHT-EMITTING DIODE (HB LED) 50FIGURE 19 STRUCTURE OF HB LED 50TABLE 16 GLOBAL MARKET FOR FLIP CHIPS USED IN HB-LED APPLICATIONS BYREGION, THROUGH 2018 ($ MILLIONS) 51FIGURE 20 Y-O-Y GROWTH OF THE MARKET FOR FLIP CHIPS USED IN HB-LEDAPPLICATIONS, 2012–2018 ($ MILLIONS, %) 52SMALL LOGIC, RF, POWER, ANALOG ICS 52TABLE 17 GLOBAL MARKET FOR FLIP CHIPS USED IN RF APPLICATIONS BY REGION,THROUGH 2018 ($ MILLIONS) 53FIGURE 21 Y-O-Y GROWTH OF THE GLOBAL MARKET FOR FLIP CHIPS USED IN RFAPPLICATIONS, 2012–2018 ($ BILLIONS) 532.5D AND 3D SIP/SOC 54FIGURE 22 ARCHITECTURE OF 2.5D IC 54FIGURE 23 STRUCTURE OF 3D IC 54TABLE 18 GLOBAL MARKET FOR FLIP CHIPS USED IN 2.5D/3D APPLICATIONS BYREGION, THROUGH 2018 ($ MILLIONS) 55

CHAPTER 6 FLIP CHIP TECHNOLOGY MARKET BY END USE 57

INTRODUCTION 57MARKET OVERVIEW 57TABLE 19 GLOBAL FLIP CHIP MARKET BY END USE, THROUGH 2018 ($ MILLIONS) 57FIGURE 24 GLOBAL FLIP CHIP TECHNOLOGY MARKET BY END USE, 2012-2018 ($MILLIONS) 58MARKET DYNAMICS 59DRIVERS 59Introduction of Smart Technologies 59Research and Development Initiatives 59RESTRAINTS 59New Innovation Takes Time 59SMARTPHONES 59FIGURE 25 Y-O-Y GROWTH OF THE GLOBAL MARKET FOR FLIP CHIPS USED INSMARTPHONES, 2012-2018 ($ BILLIONS) 59LAPTOPS 60FIGURE 26 Y-O-Y GROWTH OF THE GLOBAL MARKET FOR FLIP CHIPS USED INLAPTOPS, 2012–2018 ($ MILLIONS, %) 61DESKTOP CPUS 61FIGURE 27 Y-O-Y GROWTH OF THE GLOBAL MARKET FOR FLIP CHIPS USED INDESKTOP CPU, 2012–2018 ($ MILLIONS, %) 61GPU AND CHIPSETS 62FIGURE 28 Y-O-Y GROWTH OF THE GLOBAL MARKET FOR FLIP CHIPS USED IN GPUAND CHIPSET APPLICATIONS, 2012–2018 ($ MILLIONS, %) 62THER COMPUTING DEVICES 63FIGURE 29 Y-O-Y GROWTH OF THE GLOBAL MARKET FOR FLIP CHIPS USED INOTHER COMPUTING DEVICES, 2012–2018 ($ MILLIONS, %) 63AUTOMOTIVE 64FIGURE 30 Y-O-Y GROWTH OF THE GLOBAL MARKET FOR FLIP CHIPS USED INAUTOMOTIVE APPLICATIONS, 2012–2018 ($ MILLIONS, %) 64ROBOTICS 65FIGURE 31 Y-O-Y GROWTH OF THE GLOBAL MARKET FOR FLIP CHIPS USED INROBOTICS, 2012–2018 ($ MILLIONS, %) 66MEDICAL DEVICES 66FIGURE 32 Y-O-Y GROWTH OF THE GLOBAL MARKET FOR FLIP CHIPS USED INMEDICAL DEVICES, 2012-2018 ($ MILLIONS, %) 66SMART TECHNOLOGIES 67FIGURE 33 Y-O-Y GROWTH OF THE GLOBAL MARKET FOR FLIP CHIPS USED INSMART TECHNOLOGIES, 2012–2018 ($ MILLIONS, %) 67INDUSTRIAL APPLICATIONS 68FIGURE 34 Y-O-Y GROWTH OF THE GLOBAL MARKET FOR FLIP CHIPS USED ININDUSTRIAL APPLICATIONS, 2012–2018 ($ MILLIONS, %) 68

CHAPTER 7 FLIP CHIP TECHNOLOGY MARKET BY GEOGRAPHICAL REGION 71

INTRODUCTION 71FIGURE 35 GEOGRAPHICAL SEGMENTATION OF THE FLIP CHIP MARKET 71MARKET SNAPSHOT 71TABLE 20 FLIP CHIP PRODUCTION BY REGION, THROUGH 2018 ($ MILLIONS) 72TABLE 21 GLOBAL FLIP CHIP MARKET END USE DEMAND BY REGION, THROUGH2018 ($ MILLIONS) 72NORTH AMERICA 72TABLE 22 NORTH AMERICAN FLIP CHIP PRODUCTION BY COUNTRY, THROUGH 2018($ MILLIONS) 73TABLE 23 NORTH AMERICAN FLIP CHIP MARKET BY END USE DEMAND ANDCOUNTRY, THROUGH 2018 ($ MILLIONS) 73TABLE 24 NORTH AMERICAN FLIP CHIP MARKET BY END USE DEMAND, THROUGH2018 ($ MILLIONS) 74RULES AND REGULATIONS IN NORTH AMERICA 74EUROPE 75TABLE 25 EUROPEAN FLIP CHIP PRODUCTION BY COUNTRY, THROUGH 2018 ($MILLIONS) 75TABLE 26 EUROPEAN FLIP CHIP MARKET BY END USE DEMAND AND COUNTRY,THROUGH 2018 ($ MILLIONS) 76TABLE 27 EUROPEAN FLIP CHIP MARKET BY END USE DEMAND, THROUGH 2018 ($MILLIONS) 76RULES AND REGULATIONS IN EUROPE 77ROHS 77RoHS 2 77ASIA-PACIFIC 78TABLE 28 ASIA-PACIFIC FLIP CHIP MARKET BY PRODUCTION AND COUNTRY,THROUGH 2018 ($ MILLIONS) 78TABLE 29 ASIA-PACIFIC FLIP CHIP MARKET BY END USE DEMAND AND COUNTRY,THROUGH 2018 ($ MILLIONS) 79TABLE 30 ASIA-PACIFIC FLIP CHIP MARKET BY END USE DEMAND, THROUGH 2018($ MILLIONS) 79RULES AND REGULATIONS BY VARIOUS ECONOMIES IN ASIA-PACIFIC 80China 80REST OF THE WORLD (ROW) 80TABLE 31 ROW FLIP CHIP TECHNOLOGY MARKET BY END USE DEMAND, THROUGH2018 ($ MILLIONS) 80

CHAPTER 8 INDUSTRY STRUCTURE AND COMPETITIVE ANALYSIS 83

INDUSTRY STRUCTURE 83INFLUENTIAL FACTORS 83FORECAST COMPONENTS 83FIGURE 36 INDUSTRY REVENUE MODEL 83MARKET SHARE ANALYSIS 85TABLE 32 MARKET SHARE ANALYSIS OF FLIP CHIP MANUFACTURERS, 2012-2013(%/$ MILLIONS) 85PORTER FIVE FORCES 86FIGURE 37 PORTER FIVE FORCES FOR FLIP CHIPS 86THREAT OF POTENTIAL COMPETITORS 86THREAT FROM SUBSTITUTES 87BARGAINING POWER OF SUPPLIER 87BARGAINING POWER OF BUYER 87INTENSE COMPETITION 87PATENT ANALYSIS 87PATENTS BY REGION 87FIGURE 38 REGIONAL ANALYSES OF PATENTS, 2010-2013* (NO. OF PATENTS PERYEAR) 88PATENTS BY YEAR 88FIGURE 39 NUMBER OF PATENTS FILED BY YEAR, 2010-2013* 89

CHAPTER 9 COMPANY PROFILES 91

ADVANCED SEMICONDUCTOR ENGINEERING INC. 91COMPANY OVERVIEW 91FINANCIAL OVERVIEW 91FIGURE 40 ADVANCED SEMICONDUCTOR ENGINEERING ANNUAL REVENUE,2010-2012 ($ BILLIONS) 92BUSINESS STRATEGIES 92RECENT DEVELOPMENTS 92AMKOR TECHNOLOGY INC. 93COMPANY OVERVIEW 93FINANCIAL OVERVIEW 93FIGURE 41 AMKOR TECHNOLOGY INC. ANNUAL REVENUE, 2010-2012 ($ BILLIONS) 93BUSINESS STRATEGIES 94RECENT DEVELOPMENTS 94GLOBAL FOUNDRIES U.S. INC. 94COMPANY OVERVIEW 94FINANCIAL OVERVIEW 95FIGURE 42 GLOBAL FOUNDRIES U.S. ANNUAL REVENUE, 2010-2012 ($ BILLIONS) 95BUSINESS STRATEGIES 95RECENT DEVELOPMENTS 96IBM CORP. 96COMPANY OVERVIEW 96FINANCIAL OVERVIEW 97FIGURE 43 IBM CORP. ANNUAL REVENUE, 2010-2012 ($ BILLIONS) 97BUSINESS STRATEGIES 97RECENT DEVELOPMENTS 98INTEL CORP. 98COMPANY OVERVIEW 98FINANCIAL OVERVIEW 99FIGURE 44 INTEL CORP. ANNUAL REVENUE, 2010-2012 ($ BILLIONS) 99BUSINESS STRATEGIES 99RECENT DEVELOPMENTS 100NEPES PTE. LTD. 100COMPANY OVERVIEW 100FINANCIAL OVERVIEW 100FIGURE 45 NEPES PTE LTD. ANNUAL REVENUE, 2010-2012 ($ BILLIONS) 100BUSINESS STRATEGIES 101RECENT DEVELOPMENTS 101POWERTECH TECHNOLOGY INC. 101COMPANY OVERVIEW 102FINANCIAL OVERVIEW 102FIGURE 46 POWERTECH TECHNOLOGY INC. ANNUAL REVENUE, 2010-2012 ($BILLIONS) 102BUSINESS STRATEGIES 103RECENT DEVELOPMENTS 103SAMSUNG ELECTRONICS CO. LTD. 103COMPANY OVERVIEW 103FINANCIAL OVERVIEW 104FIGURE 47 SAMSUNG ELECTRONICS ANNUAL REVENUE, 2010-2012 ($ BILLIONS) 104BUSINESS STRATEGIES 104RECENT DEVELOPMENTS 104SK HYNIX INC. 105COMPANY OVERVIEW 105FINANCIAL OVERVIEW 106FIGURE 48 SK HYNIX INC. ANNUAL REVENUE, 2010-2012 ($ BILLIONS) 106BUSINESS STRATEGIES 106RECENT DEVELOPMENTS 106STATS CHIPPAC LTD. 107COMPANY OVERVIEW 107FINANCIAL OVERVIEW 107FIGURE 49 STATS CHIPPAC LTD. ANNUAL REVENUE, 2010-2012 ($ BILLIONS) 107BUSINESS STRATEGIES 108RECENT DEVELOPMENTS 108STMICROELECTRONICS NV (STM) 109COMPANY OVERVIEW 109FINANCIAL OVERVIEW 109FIGURE 50 STMICROELECTRONICS NV ANNUAL REVENUE, 2010-2012 ($ BILLIONS) 109BUSINESS STRATEGIES 110RECENT DEVELOPMENTS 110TAIWAN SEMICONDUCTOR MANUFACTURING CO. 111COMPANY OVERVIEW 111FINANCIAL OVERVIEW 111FIGURE 51 TAIWAN SEMICONDUCTOR MANUFACTURING CO. ANNUAL REVENUE,2010-2012 ($ BILLIONS) 111BUSINESS STRATEGIES 112RECENT DEVELOPMENTS 112TEXAS INSTRUMENTS INC. 113COMPANY OVERVIEW 113FINANCIAL OVERVIEW 113FIGURE 52 TEXAS INSTRUMENTS ANNUAL REVENUE, 2010-2012 ($ BILLIONS) 113BUSINESS STRATEGIES 114RECENT DEVELOPMENTS 114

LIST OF TABLES

SUMMARY TABLE GLOBAL MARKET FOR FLIP CHIP TECHNOLOGY BY WAFER

BUMPING PROCESS, THROUGH 2018 ($ MILLIONS) 7

TABLE 1 GLOBAL FLIP CHIP UNIT SALES BY WAFER BUMPING PROCESS, THROUGH

2018 (UNITS) 18

TABLE 2 GLOBAL MARKET FOR FLIP CHIP TECHNOLOGY MARKET BASED ON THE

AVERAGE PRICE PER UNIT OF THE WAFER BUMPING PROCESS, THROUGH 2018 ($

MILLIONS)

19

TABLE 3 GLOBAL MARKET FOR CU PILLAR FLIP CHIPS BY END USE, THROUGH 2018

($ MILLIONS) 22

TABLE 4 MECHANICAL PROPERTIES OF SN-PB 26

TABLE 5 PHYSICAL PROPERTIES OF SN-PB 26

TABLE 6 GLOBAL MARKET FOR SN-PB FLIP CHIPS BY END USE, THROUGH 2018 ($

MILLIONS) 27

TABLE 7 CHARACTERISTICS OF VARIOUS ELEMENTS 30

TABLE 8 CHARACTERISTIC OF VARIOUS MIXED COMPOSITIONS 30

TABLE 9 GLOBAL MARKET FOR PB-FREE FLIP CHIPS BY END USE, THROUGH 2018 ($

MILLIONS) 32

TABLE 10 GLOBAL MARKET FOR GOLD STUD BUMPED FLIP CHIPS BY END USE,

THROUGH 2018 ($ MILLIONS) 36

TABLE 11 GLOBAL MARKET FOR FLIP CHIP TECHNOLOGIES BY APPLICATION,

THROUGH 2018 ($ MILLIONS) 41

TABLE 12 GLOBAL MARKET FOR FLIP CHIPS USED IN 2D LOGIC SOC APPLICATIONS

BY REGION, THROUGH 2018 ($ MILLIONS) 45

TABLE 13 COMPARATIVE ANALYSES OF VARIOUS TYPES OF MEMORY 45

TABLE 14 GLOBAL MARKET FOR FLIP CHIPS USED IN MEMORY APPLICATIONS BY

REGION, THROUGH 2018 ($ MILLIONS) 47

TABLE 15 GLOBAL MARKET FOR FLIP CHIPS USED IN IMAGING TECHNOLOGIES BY

REGION, THROUGH 2018 ($ MILLIONS) 49

TABLE 16 GLOBAL MARKET FOR FLIP CHIPS USED IN HB-LED APPLICATIONS BY

REGION, THROUGH 2018 ($ MILLIONS) 51

TABLE 17 GLOBAL MARKET FOR FLIP CHIPS USED IN RF APPLICATIONS BY REGION,

THROUGH 2018 ($ MILLIONS) 53

TABLE 18 GLOBAL MARKET FOR FLIP CHIPS USED IN 2.5D/3D APPLICATIONS BY

REGION, THROUGH 2018 ($ MILLIONS) 55

TABLE 19 GLOBAL FLIP CHIP MARKET BY END USE, THROUGH 2018 ($ MILLIONS) 57

TABLE 20 FLIP CHIP PRODUCTION BY REGION, THROUGH 2018 ($ MILLIONS) 72

TABLE 21 GLOBAL FLIP CHIP MARKET END USE DEMAND BY REGION, THROUGH

2018 ($ MILLIONS) 72

TABLE 22 NORTH AMERICAN FLIP CHIP PRODUCTION BY COUNTRY, THROUGH 2018

($ MILLIONS) 73

TABLE 23 NORTH AMERICAN FLIP CHIP MARKET BY END USE DEMAND AND

COUNTRY, THROUGH 2018 ($ MILLIONS) 73

TABLE 24 NORTH AMERICAN FLIP CHIP MARKET BY END USE DEMAND, THROUGH

2018 ($ MILLIONS) 74

TABLE 25 EUROPEAN FLIP CHIP PRODUCTION BY COUNTRY, THROUGH 2018 ($

MILLIONS) 75

TABLE 26 EUROPEAN FLIP CHIP MARKET BY END USE DEMAND AND COUNTRY,

THROUGH 2018 ($ MILLIONS) 76

TABLE 27 EUROPEAN FLIP CHIP MARKET BY END USE DEMAND, THROUGH 2018 ($

MILLIONS) 76

TABLE 28 ASIA-PACIFIC FLIP CHIP MARKET BY PRODUCTION AND COUNTRY,

THROUGH 2018 ($ MILLIONS) 78

TABLE 29 ASIA-PACIFIC FLIP CHIP MARKET BY END USE DEMAND AND COUNTRY,

THROUGH 2018 ($ MILLIONS) 79

TABLE 30 ASIA-PACIFIC FLIP CHIP MARKET BY END USE DEMAND, THROUGH 2018 ($

MILLIONS) 79

TABLE 31 ROW FLIP CHIP TECHNOLOGY MARKET BY END USE DEMAND, THROUGH

2018 ($ MILLIONS) 80

TABLE 32 MARKET SHARE ANALYSIS OF FLIP CHIP MANUFACTURERS, 2012-2013

(%/$ MILLIONS) 85

LIST OF FIGURES

SUMMARY FIGURE GLOBAL MARKET FOR FLIP CHIP TECHNOLOGY BY WAFER

BUMPING PROCESS, THROUGH 2018 ($ MILLIONS) 7

FIGURE 1 DEVELOPMENT OF WAFER BUMPING TECHNOLOGIES, 1960-2004 9

FIGURE 2 SOLDER EVAPORATION PROCESS 10

FIGURE 3 SOLDER ALLOY ELECTROPLATING PROCESS 10

FIGURE 4 SOLDER PASTE SCREENING PROCESS 11

FIGURE 5 VALUE CHAIN OF FLIP CHIP TECHNOLOGY INDUSTRY 13

FIGURE 6 FLIP CHIP INDUSTRY SUPPLY CHAIN 14

FIGURE 7 GLOBAL FLIP CHIP TECHNOLOGY MARKET SHARES BY WAFER BUMPING

PROCESS, 2012 AND 2018 (%) 17

FIGURE 8 GLOBAL FLIP CHIP TECHNOLOGY MARKET SHARES OF UNIT SHIPMENTS BY

WAFER BUMPING PROCESS, 2012 AND 2018 (%) 18

FIGURE 9 Y-O-Y GROWTH IN DOLLAR AND UNIT SALES OF CU PILLAR FLIP CHIPS,

THROUGH 2018 (%) 22

FIGURE 10 Y-O-Y GROWTH IN DOLLAR AND UNIT SALES OF SN-PB FLIP CHIPS,

THROUGH 2018 (%) 27

FIGURE 11 Y-O-Y GROWTH IN DOLLAR AND VOLUME SALES OF LEAD-FREE FLIP

CHIPS, 2013-2018 (%) 33

FIGURE 12 Y-O-Y GROWTH IN DOLLAR AND VOLUME SALES OF GOLD STUD BUMPED

FLIP CHIPS, THROUGH 2018 (%) 36

FIGURE 13 MARKET SEGMENTATION BY APPLICATION 40

FIGURE 14 GLOBAL MARKET FOR FLIP CHIP TECHNOLOGIES BY APPLICATION, 2012-

2018 ($ MILLIONS) 41

FIGURE 15 STRUCTURE OF MULTI-CHIP MODULE 43

FIGURE 16 STRUCTURE OF SYSTEM ON CHIP 43

FIGURE 17 Y-O-Y GROWTH OF THE MARKET FOR FLIP CHIPS USED IN MEMORY

APPLICATIONS, THROUGH 2018 ($ MILLIONS, %) 47

FIGURE 18 Y-O-Y GROWTH OF THE MARKET FOR FLIP CHIPS USED IN IMAGING

TECHNOLOGIES, 2012–2018 ($ MILLIONS, %) 50

FIGURE 19 STRUCTURE OF HB LED 50

FIGURE 20 Y-O-Y GROWTH OF THE MARKET FOR FLIP CHIPS USED IN HB-LED

APPLICATIONS, 2012–2018 ($ MILLIONS, %) 52

FIGURE 21 Y-O-Y GROWTH OF THE GLOBAL MARKET FOR FLIP CHIPS USED IN RF

APPLICATIONS, 2012–2018 ($ BILLIONS) 53

FIGURE 22 ARCHITECTURE OF 2.5D IC 54

FIGURE 23 STRUCTURE OF 3D IC 54

FIGURE 24 GLOBAL FLIP CHIP TECHNOLOGY MARKET BY END USE, 2012-2018 ($

MILLIONS) 58

FIGURE 25 Y-O-Y GROWTH OF THE GLOBAL MARKET FOR FLIP CHIPS USED IN

SMARTPHONES, 2012-2018 ($ BILLIONS) 59

FIGURE 26 Y-O-Y GROWTH OF THE GLOBAL MARKET FOR FLIP CHIPS USED IN

LAPTOPS, 2012–2018 ($ MILLIONS, %) 61

FIGURE 27 Y-O-Y GROWTH OF THE GLOBAL MARKET FOR FLIP CHIPS USED IN

DESKTOP CPU, 2012–2018 ($ MILLIONS, %) 61

FIGURE 28 Y-O-Y GROWTH OF THE GLOBAL MARKET FOR FLIP CHIPS USED IN GPU

AND CHIPSET APPLICATIONS, 2012–2018 ($ MILLIONS, %) 62

FIGURE 29 Y-O-Y GROWTH OF THE GLOBAL MARKET FOR FLIP CHIPS USED IN OTHER

COMPUTING DEVICES, 2012–2018 ($ MILLIONS, %) 63

FIGURE 30 Y-O-Y GROWTH OF THE GLOBAL MARKET FOR FLIP CHIPS USED IN

AUTOMOTIVE APPLICATIONS, 2012–2018 ($ MILLIONS, %) 64

FIGURE 31 Y-O-Y GROWTH OF THE GLOBAL MARKET FOR FLIP CHIPS USED IN

ROBOTICS, 2012–2018 ($ MILLIONS, %) 66

FIGURE 32 Y-O-Y GROWTH OF THE GLOBAL MARKET FOR FLIP CHIPS USED IN

MEDICAL DEVICES, 2012-2018 ($ MILLIONS, %) 66

FIGURE 33 Y-O-Y GROWTH OF THE GLOBAL MARKET FOR FLIP CHIPS USED IN SMART

TECHNOLOGIES, 2012–2018 ($ MILLIONS, %) 67

FIGURE 34 Y-O-Y GROWTH OF THE GLOBAL MARKET FOR FLIP CHIPS USED IN

INDUSTRIAL APPLICATIONS, 2012–2018 ($ MILLIONS, %) 68

FIGURE 35 GEOGRAPHICAL SEGMENTATION OF THE FLIP CHIP MARKET 71

FIGURE 36 INDUSTRY REVENUE MODEL 83

FIGURE 37 PORTER FIVE FORCES FOR FLIP CHIPS 86

FIGURE 38 REGIONAL ANALYSES OF PATENTS, 2010-2013* (NO. OF PATENTS PER

YEAR) 88

FIGURE 39 NUMBER OF PATENTS FILED BY YEAR, 2010-2013* 89

FIGURE 40 ADVANCED SEMICONDUCTOR ENGINEERING ANNUAL REVENUE,

2010-2012 ($ BILLIONS) 92

FIGURE 41 AMKOR TECHNOLOGY INC. ANNUAL REVENUE, 2010-2012 ($ BILLIONS) 93

FIGURE 42 GLOBAL FOUNDRIES U.S. ANNUAL REVENUE, 2010-2012 ($ BILLIONS) 95

FIGURE 43 IBM CORP. ANNUAL REVENUE, 2010-2012 ($ BILLIONS) 97

FIGURE 44 INTEL CORP. ANNUAL REVENUE, 2010-2012 ($ BILLIONS) 99

FIGURE 45 NEPES PTE LTD. ANNUAL REVENUE, 2010-2012 ($ BILLIONS) 100

FIGURE 46 POWERTECH TECHNOLOGY INC. ANNUAL REVENUE, 2010-2012 ($

BILLIONS) 102

FIGURE 47 SAMSUNG ELECTRONICS ANNUAL REVENUE, 2010-2012 ($ BILLIONS) 104

FIGURE 48 SK HYNIX INC. ANNUAL REVENUE, 2010-2012 ($ BILLIONS) 106

FIGURE 49 STATS CHIPPAC LTD. ANNUAL REVENUE, 2010-2012 ($ BILLIONS) 107

FIGURE 50 STMICROELECTRONICS NV ANNUAL REVENUE, 2010-2012 ($ BILLIONS) 109

FIGURE 51 TAIWAN SEMICONDUCTOR MANUFACTURING CO. ANNUAL REVENUE,

2010-2012 ($ BILLIONS) 111

FIGURE 52 TEXAS INSTRUMENTS ANNUAL REVENUE, 2010-2012 ($ BILLIONS) 113

To order this report: Flip-Chip Technologies and Global Markets http://www.reportlinker.com/p01941933/Flip-Chip-Technologies-and-Global-Markets.html#utm_source=prnewswire&utm_medium=pr&utm_campaign=Electronic_Component_and_Semiconductor

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